| Part Number |
SMDSWLF.006 1G
|
|---|---|
| Manufacturer | Chip Quik, Inc. |
| Other Part Numbers |
315-SMDSWLF.0061G-ND
315-SMDSWLF.0061G
|
| Description | SOLDER WIRE SN96.5/AG3/CU0.5 |
| Detailed Description | Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.035 oz (1g) |
| Manufacturer Standard Lead Time | 4 weeks |
| Datasheet | Datasheet |
| Category | ||
|---|---|---|
| Manufacturer | Chip Quik, Inc. | |
| Series | ||
| Packaging |
Bulk
|
|
| Part Status | Active | |
| Diameter | 0.006" (0.15mm) | |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
| Type | Wire Solder | |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) | |
| Form | Spool, 0.035 oz (1g) | |
| Process | Lead Free | |
| Flux Type | No-Clean, Water Soluble |
| RESOURCE TYPE | LINK | |
|---|---|---|
| Datasheets | SMDSWLF.006 1G |
| ATTRIBUTE | DESCRIPTION | |
|---|---|---|
| ECCN | EAR99 | |
| HTSUS | 8311.30.6000 | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| REACH Status | REACH Unaffected | |
| RoHS Status | ROHS3 Compliant |
| QUANTITY | UNIT PRICE | EXT PRICE |
|---|---|---|
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